Pham Viet Hung

School: School of Science, Engineering and Technology
Department: Electrical Electronics Robotics and Mechatronics
Position: Teaching Assistant
Location: RMIT Saigon South
Email: hung.phamviet2@rmit.edu.vn

Hung received his Master's Degree at RMIT Vietnam as the first scholarship cohort when ECE Program was deployed in VN in 2011. Then he become an engineer at Intel VN working on Test and Assembly Process and helped to bring the first CPU production line to Intel VN.

Hung pursued his Academic journey in Semiconductor Physics and completed his PhD at RMIT University with significant research results. Since then he started his academic career as Teaching Assistant at RMIT University.

  • PhD in Semiconductor Materials at RMIT University (2016 – 2019): Research Topic: Thermal stability of electrical characteristics of Carbon contact to Si/SiC. 
  • M.A. at RMIT University (2011– 2013): Electrical & Computer Engineering 
  • B.A. at HCM University of Technology (2006– 2010): Electrical & Computer Engineering

Electrical & Computer Engineering

  • Electrical & Computer Engineering
  • Semiconductor Material
  • Manufacturing
  • H. V. Pham et al., "Temperature dependent electrical characteristics of rectifying graphitic contacts to p-type silicon," Semiconductor Science and Technology, vol. 34, no. 1, p. 015003, 2018. 
  • H. Pham, H. N. Tran, A. S. Holland, and J. G. Partridge, "Temperature-Dependent Electrical Characteristics and Extraction of Richardson Constant from Graphitic-C/n-Type 6H-SiC Schottky Diodes," Journal of Electronic Materials, pp. 1-6, 2019. 
  • Hung V. Pham, N. Le Huy, A. Stojcevski, and A. S. Holland, "Impact of impurities in 4H, 6H and 3C-SiC substrate on reverse recovery time of pn junction," in Information Science and Technology (ICIST), 2017 Seventh International Conference on, 2017, pp. 299-303: IEEE. 
  • Hung V. Pham, A. S. Holland, H. L. Nguyen, J. G. Partridge, and H. N. Tran, "Modified electrical characteristics of filtered cathodic vacuum arc amorphous carbon film on n-Si (100) by heat treatment," in Micro and Nanoelectronics (RSM), 2017 IEEE Regional Symposium on, 2017, pp. 38-41: IEEE. 
  • Hung V. Pham, S. N. Demidenko, and G. M. Merola, "Eliminating Re-Burn-In in semiconductor manufacturing through statistical analysis of production test data," in Instrumentation and Measurement Technology Conference (I2MTC), 2017 IEEE International, 2017, pp. 1-6: IEEE. 
  • H. V. Pham, S. Luong, A. S. Holland, and H. L. Nguyen, "Impact of temperature on electrical performance of Ni film on n-type 4H-SÌC contacts in terms of micropipes density," in Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom), 2018 2nd International Conference on, 2018, pp. 132-135: IEEE.

Develop failure criteria, write technical specifications, prepare training materials and deliver training for technicians to understand and follow.

Integrate the first CPU product and multiple strip processing products from Malaysia to Vietnam flawlessly.

  • Teaching Assistant at SST, RMIT University (2020) 
  • Yield Integration Engineer at Intel Products Vietnam CO. LTD., HCMC (2013 –2016)